Electronics Forum | Tue Jun 20 20:22:15 EDT 2000 | Dave F
Hi Jack: Welcome!!!! Yours sounds like an interesting project. In response to your questions: A1. Each traditional L8 run requires 8 runs. So, how did you select a L8? A2. In addition solder height and volume as characteristics, consider deposit
Electronics Forum | Tue Sep 19 14:40:13 EDT 2000 | Erick Russell
It is always a good idea to heat the entire board to 100C to 140C prior to reflowing the site to be reworked to reduce warp and localized stress. (Thermal uniformity of the preheater is key here). For a BGA, the laser is programmed to heat only the
Electronics Forum | Wed Jun 13 16:58:26 EDT 2001 | Ken Lester
Greg; The universal profile concept maybe misleading. the main objective of a reflow system is to reach a certain temperature and maintain it for the required period of time. If your initial profile is set to accomodate this on any board the only va
Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon
| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appr
Electronics Forum | Tue Oct 16 17:38:42 EDT 2001 | lileubie
Depending on the type of teflon material, thickness, and reflow profile requirements, these will have a direct bearing on your maximum process allowable PCB pallet size. You'll want to be careful on how big the PCB or pallet is. Larger teflon PCBs
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Sun May 12 21:45:10 EDT 2002 | ianchan
Hi Dave, we tried the net search. anything close to the part no. draws only the "reliability data sheets" with a small print ref to JSTD-020 standards. this implies a 215deg-C @3 cycles of Reflow Oven processing. however as this can be claimed as a
Electronics Forum | Thu May 16 22:37:22 EDT 2002 | xzinxzin
anyone experience to solve the non-wetting on Microleadframe packages component terminal sides. 1)I test the components solderbility in dip and look test, in solder pot at 240 deg C,the wetting on the sides is ok. but I run on mass production in refl
Electronics Forum | Wed Jun 05 12:22:45 EDT 2002 | Bob
No. Placement force is fine. Also boards have been inspected prior to reflow using microscope with no evidance of misplaced solder balls. The ramp rate has been reduced to acceptable limits, typically .8 - 1.5 degrees per sec. Outgassing from eithe
